【英文标准名称】:Informationtechnology.Opensystemsinterconnection.Abstractservicedefinition
【原文标准名称】:信息技术.开式系统互连.目录.第3部分:文摘服务定义
【标准号】:BSISO/IEC9594-3-1990
【标准状态】:作废
【国别】:英国
【发布日期】:1991-03-29
【实施或试行日期】:
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:计算机网络;数据处理;开放系统互连;信息交流;数据传输;情报检索;数据集;数据库;人名地址录;误差;情报系统;数据传送;数据组织
【英文主题词】:informationretrieval;computernetworks;dataorganization;setsofdata;directories;databases;informationexchange;opensystemsinterconnection;errors;datatransmission;datatransfer;asn.1;dataprocessing;informationsystems;applicationlayer(osi)
【摘要】:
【中国标准分类号】:L79
【国际标准分类号】:35_100_70
【页数】:52P.;A4
【正文语种】:英语


Product Code:SAE ARP1870
Title:Aerospace Systems Electrical Bonding and Grounding for Electromagnetic Compatibility and Safety
Issuing Committee:Ae-4 Electromagnetic Environmental Effects (E3) Committee
Scope: This document establishes the minimum requirements for the electrical bonding and grounding of electric, avionic, armament, communication, and electronic equipment installations for aeronautical and aerospace applications. The bonding and grounding requirements specified herein are to ensure that an adequate low resistance return path for electric, avionic, armament, communication and electronic equipment is achieved which can withstand operating conditions and corrosion. This is essential for the reduction of coupling of electromagnetic fields into or out of the equipment as well as for providing electrical stability to control the currents and/or voltages caused by static charges and discharges and for suppressing the hazardous effects thereof. A prerequisite to effective control of electromagnetic interference (EMI) and the hazards of electrical effects is the establishing of a reference ground plane and the means of providing adequate connections to it. Making a connection to the ground plane is grounding, and the mechanical method of providing a low impedance union between conductors is electrical bonding.
Rationale: This document establishes the minimum requirements for the electrical bonding and grounding of electric, avionic, armament, communication, and electronic equipment installations for aeronautical and aerospace applications. The bonding and grounding requirements specified herein are to ensure that an adequate low resistance return path for electric, avionic, armament, communication and electronic equipment is achieved which can withstand operating conditions and corrosion. This is essential for the reduction of coupling of electromagnetic fields into or out of the equipment as well as for providing electrical stability to control the currents and/or voltages caused by static charges and discharges and for suppressing the hazardous effects thereof. A prerequisite to effective control of electromagnetic interference (EMI) and the hazards of electrical effects is the establishing of a reference ground plane and the means of providing adequate connections to it. Making a connection to the ground plane is grounding, and the mechanical method of providing a low impedance union between conductors is electrical bonding.